With the rapid development of new energy vehicles, 5G communications, and artificial intelligence, third-generation semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) have become a key battleground in global technology competition. As the base material for semiconductor device manufacturing, the processing quality of wafer substrates directly affects device performance, reliability, and final yield. However, third-generation semiconductor materials generally exhibit high hardness, high brittleness, and excellent chemical stability, leading to challenges such as low processing efficiency, difficulty in controlling subsurface damage, and high processing costs-imposing stricter requirements on processing tools and processes.
In fact, whether for semiconductor wafers or advanced ceramic materials such as alumina, zirconia, silicon nitride, and silicon carbide, the processing relies on the support of superhard material tools. In recent years, as the semiconductor industry demands ever-higher precision, surface quality, and consistency, the development of high-precision diamond tools has become a critical focus of industry attention.
As a key player in China's superhard material tool industry, the company has long specialized in the R&D, production, and sales of superhard material products. It has accumulated extensive experience in product development and application in the processing of hard and brittle ceramics, stone, precision mechanical components, and more, laying a solid foundation for its active expansion into the precision processing market for semiconductors.
For enterprises in advanced ceramic processing, third-generation semiconductor materials, and semiconductor equipment manufacturing, this report will explore, from the perspective of processing tools, the technical connections and differences between engineering ceramics and semiconductor ceramics processing, offering new insights and references for improving processing efficiency, surface quality, and yield of hard and brittle materials.