With exceptional properties such as high-temperature resistance, plasma corrosion resistance, high purity, and high electrical insulation, advanced ceramics serve as critical raw materials for key components in semiconductor equipment across the entire process flow-including etching, thin-film deposition, lithography, CMP, cleaning, and packaging/testing. These components directly impact chip yield and equipment stability. This article, structured around the chip manufacturing process flow, reviews the applications of ceramic components in domestic equipment manufacturers, industrial progress, and the current state of import substitution, process by process.
I. Wafer Manufacturing
Key components and materials: ceramic trays, ceramic heaters, semiconductor valves, vacuum chamber parts (Al₂O₃, Si₃N₄, SiC, etc.)
Key performance requirements: high purity, high-temperature resistance, thermal shock resistance, high flatness – to support substrate preparation for silicon wafers.
II. Thermal Processing (Oxidation / Diffusion / Annealing)
Key components and materials: SiC boats, furnace tube ceramic parts, ceramic heaters, ceramic nozzles, ceramic valves
Key performance requirements: high-temperature resistance (≥1200°C), thermal shock resistance, low outgassing, high purity – suitable for high-temperature oxidation/diffusion/annealing processes.
III. Thin-Film Deposition
Key components and materials: ceramic heaters (AlN, Al₂O₃, Si₃N₄); deposition rings, chamber liners, gas distribution parts (SiC, Al₂O₃)
Key performance requirements: high-precision temperature uniformity within ±1°C, excellent thermal stability, low outgassing, resistance to high-temperature deformation – suitable for long-duration continuous deposition.
IV. Lithography and Coating/Development
Key components and materials: precision stages, ceramic vacuum chucks, mask holders, vibration-damping bases (cordierite, SiC, low-expansion glass-ceramics such as Zerodur); for coat/develop equipment: ceramic arms, microporous ceramic chucks, vacuum fingers
Key performance requirements: ultra-low coefficient of thermal expansion, nano-level ultra-high flatness, high rigidity, vibration damping – to ensure high-precision exposure in lithography; coating/developing parts also require chemical corrosion resistance and low particle generation.
V. Etching
Key components and materials: electrostatic chucks (Al₂O₃, AlN); focus rings, showerheads, gas distribution plates, chamber liners (SiC, Y₂O₃ as coating material)
Key performance requirements: plasma corrosion resistance, ultra-high purity, low particle shedding, high electrical insulation – suitable for high-frequency, high-intensity etching.
VI. Ion Implantation
Key components and materials: ceramic screw valves, insulating ceramic structural parts, high-temperature corrosion-resistant ceramic components
Key performance requirements: high purity, high-voltage resistance, low outgassing, dimensional stability – suitable for ion beam transport and isolation.
VII. CMP (Chemical Mechanical Planarization)
Key components and materials: ceramic chucks, ceramic worktables, porous ceramic plates
Key performance requirements: high flatness, high rigidity, wear resistance, chemical corrosion resistance – to support wafer planarization.
VIII. Cleaning
Key components and materials: ceramic nozzles, ceramic valves, corrosion-resistant ceramic structural parts
Key performance requirements: resistance to strong acids/alkalis, high purity, low particle release – suitable for wet cleaning environments.