What are the advantages and disadvantages of aluminum nitride hot press sintered ceramics?

The advantages of aluminum nitride hot press sintered ceramics include:
High thermal conductivity: The thermal conductivity is high, which is several times that of alumina ceramics. It can effectively conduct the heat generated by electronic devices and can be used in electronic packaging, high-power electronic device heat dissipation and other fields.
Good electrical insulation performance: It has high resistivity and dielectric strength, can be used safely in high voltage and high frequency environments, and is suitable for electronic circuit substrates, insulating gaskets, etc.
Similar thermal expansion coefficient to silicon: This makes it have a small difference in thermal expansion when used with materials such as silicon, reducing the risk of cracking or damage caused by thermal expansion and contraction.
Good corrosion resistance: It has strong resistance to chemicals such as acids, alkalis, and salts, and can be used to manufacture corrosion-resistant products.
High mechanical strength and hardness: It can withstand certain mechanical stress and wear, can be used as a structural element, and can also be used in some occasions with high material strength requirements, such as precision mechanical parts.
However, it also has some disadvantages:
High cost: Its preparation process is relatively complicated, and it has high requirements for raw materials, processes and equipment. For example, the synthesis process of high-quality aluminum nitride powder may be costly, complex in preparation, low in production efficiency, or have high equipment requirements, leading to rising raw material prices. In the sintering process, the hot pressing sintering process is complicated, has high equipment requirements, and low production efficiency; in order to find a suitable low-temperature sintering aid, manufacturers also need to invest a lot of time and energy in research and development, all of which increase costs.
High processing difficulty: Due to the high hardness of aluminum nitride ceramics, the processing process is relatively difficult, and advanced equipment and professional processing technology may be required.
Poor high-temperature oxidation resistance: It is easy to absorb moisture and hydrolyze in the atmosphere, and contact with humid air, water or water-containing liquids will generate heat and nitrogen and decompose rapidly, and react with dry oxygen above 800°C.
Color and thermal conductivity restrictions: Some aluminum nitride substrates made by hot pressing are gray in color and have low thermal conductivity (but they can still meet the requirements for use in environments where thermal conductivity is not too demanding).
Cutting and grinding requirements: The cutting efficiency is low, and the product usually needs to be ground after slicing to make the surface roughness meet the standard, but the grinding process may cause certain damage to the substrate. In addition, there are certain limitations on the thickness of hot pressing products. If the sintered blank is too thick, the product consistency in the thickness direction is poor, and the physical and chemical properties will have a certain gradient.
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