Products Description
Aluminum Nitride ceramic substrate, with the chemical name AlN (also known as nitride of aluminum or nitruro de aluminio), is an advanced ceramic material made from aluminum nitride (AlN) powder through high-temperature sintering. As a key AlN compound, it belongs to the broader category of aluminum nitride ceramics or aluminium nitride ceramic. This AIN material exhibits excellent thermal conductivity and electrical insulation, making it a critical foundational ALN material in modern high-power electronic and optoelectronic devices. Aluminum nitride ceramic substrate not only offers stable performance but also possesses good mechanical strength and corrosion resistance, making it widely applicable in fields that require efficient heat dissipation and reliable insulation. What is aluminum nitride? It is a synthetic ceramic, distinct from aluminum oxide plate or alumina ceramic tube, prized for its unique combination of properties.
| Product name | Aluminum Nitride Ceramic Substrate |
| Material | Aluminum nitride /ALN/AIN |
| Color | Customized according to the client's requirements |
| size | Customized according to the client's requirements |
| Machining accuracy | ±0.001mm |
| Packaging | Carton /Pallet/Wooden case (According to client requirement ) |
| Delivery time | Standard Product-Within 3 days |
| Items Design | According to the client's drawing or samples |
| Features | Good quality, low price, Multiple factories, deliver to you based on the one closest to your location |
| Application | Industrial Ceramics |
| Certificate | ISO, CE |
Ceramics performance parameter
| Number | Performance | Unit | Aluminum Nitride | |
| JC-AN-210 | JC-AN-170 | |||
| 1 | Density | g/cm3 | 3.32~3.34 | 3.31~3.33 |
| 2 | Flexural strength | MPa | 340~360 | 400~420 |
| 3 | Fracture toughness | MPa·m1/2 | 3.35 | 3.35 |
| 4 | Dielectric constant | εr(20℃,1MHz) | 8.8~9.0 | 8.7~8.9 |
| 5 | Hardness | GPa | 12-16 | |
| Hardness | HRC | 75-80 | ||
| 6 | Volume resistivity | Ω·cm(20℃) | 10 10 | 10 10 |
| 7 | Elastic modulus | GPa | 310 | 320 |
| 8 | Coefficient of thermal expansion | ×10-6/k | 4.8~5.0 | 4.5~4.7 |
| 9 | Compressive strength | MPa | 2100 | 2000 |
| 10 | Abrasions | g/cm2 | 0.01 | 0.01 |
| 11 | Thermal conductivity | W/m×k(20℃) | 200~220 | 160~180 |
| 12 | Poisson's ratio | / | 0.24 | 0.24 |
| 13 | Insulation strength | kv/mm | 26~28 | 30~32 |
| 14 | Temperature | ℃ | 2500 | 2500 |
Product Performance
The key properties of aluminum nitride ceramic include high thermal conductivity (aluminum nitride specific heat management is efficient), reaching 170–200 W/(m·K), which is significantly superior to alumina ceramics and close to the thermal conductivity level of metallic aluminum; low thermal expansion coefficient, which matches well with semiconductor materials like silicon, effectively reducing thermal stress; excellent aluminum nitride electrical conductivity insulation, with high volume resistivity suitable for high-voltage environments; high mechanical strength, with flexural strength ranging from 300 to 400 MPa, providing structural stability for ALN structural components; resistance to chemical corrosion, stable against most acids, alkalis, and solvents; and low dielectric constant and dielectric loss, making it suitable for high-frequency circuit applications. Additionally, it exhibits high-temperature resistance, with a usable temperature in air exceeding 1000°C, enabling its use in components like aluminum nitride heaters and ALN crucibles.
Product application
Aluminum nitride substrates (AlN substrates) are widely used in multiple fields: in high-power electronic devices, such as IGBTs and power modules, as a heat dissipation substrate or ALN heat sink to enhance thermal management efficiency; in LED lighting, as a substrate for LED chips; in semiconductor packaging, for multi-chip modules and microwave packaging (AIN substrate, aluminum nitride wafer); as a heat sink in aerospace and military electronics; in microwave/RF circuits; in sensors and actuators. Furthermore, aluminum nitride parts are engineered into various forms such as aluminum nitride tube, aluminum nitride plate, aluminum nitride crucible, aln heater, aluminum nitride ceramic heaters, and microporous ceramic suction cups. Specific high-grade products like Maruwa AlN, aluminum nitride polished substrate, and aluminum nitride ceramic thermal disc are used in demanding applications. The market offers diverse products from various aluminum nitride manufacturers and aluminum nitride suppliers, with aluminum nitride price varying based on specifications like aluminum nitride sheet price. Customization is also available, including custom aluminum nitride substrate, custom aluminum nitride ceramics, custom aluminum nitride crucible, custom aluminum nitride tube, custom aluminum nitride plate, and custom aluminum nitride parts. Other common forms include aluminium nitride sheets, aluminum nitride plates, aluminum nitride wafers, aluminium nitride wafer, and aluminum nitride pads.
Future development
With the rapid development of technologies such as 5G, artificial intelligence, and new energy, the performance requirements for heat dissipation materials are getting higher and higher. As a new type of high-performance material, aluminum nitride ceramic substrates have great room for development. In the future, with the continuous improvement of manufacturing processes and the improvement of material performance, aluminum nitride ceramic substrates will play a more important role in electronics, optoelectronics and other fields.
quality control
We strictly follow ISO 9001 quality management system to ensure consistency:
- 100% raw material inspection
- Advanced hot-pressing production lines
- In-house testing: density, hardness, microstructure analysis
- Third-party certifications (SGS, CE, ROHS available upon request)
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