In the post-Moore era, system integration has become the primary pathway for the development of transistor technology, and advanced packaging serves as the physical means to achieve high-density system integration. Advanced packaging refers to a packaging solution that achieves process complexity through the application of innovative structural designs, interconnection technologies, materials, and equipment, thereby enabling higher integration, better performance, smaller form factors, lower power consumption, and greater reliability in semiconductors. Against the backdrop of a slowing Moore's Law, advanced packaging is not only a critical back-end process in semiconductor manufacturing but also a core technological path to continuously enhance semiconductor performance and meet the complex application demands of downstream industries.
Different semiconductor products vary in electrical performance, dimensions, application scenarios, and other factors, resulting in diverse and complex packaging forms. Based on the presence and material of packaging substrates, semiconductor packaging products can be classified into different categories, each with its own packaging technologies. Traditional packaging primarily provides chip protection, size enlargement, and electrical connection. It connects chips to external circuits through methods such as wire bonding, while also offering mechanical protection and heat dissipation. Building on these core functions, advanced packaging further increases functional density, shortens interconnection lengths, and enables system-level reconfiguration, thereby boosting product integration and functional diversity without relying on breakthroughs in chip manufacturing processes.
Ceramic substrates, as an important carrier of three-dimensional interconnection technology in system integration, are a particularly critical component in packaged devices. Among them, DPC (Direct Plated Copper) ceramic substrates offer advantages such as high thermal conductivity, high circuit precision, and reduced package volume through via connections, but they are also limited by the electroplating process, with copper layer thickness typically not exceeding 150 μm. Currently, DPC technology is mainly applied in the packaging of high-power LEDs.
The rapid development of the semiconductor and electronic information industries has placed higher demands on the performance of core materials. Electronic ceramics, as key foundational materials with multifunctional coupling characteristics in electrical, magnetic, thermal, and mechanical properties, are widely used in core components such as capacitors, filters, sensors, and packaging substrates. Among these, ceramic substrates represent an important product form of electronic ceramics in power semiconductor packaging, and their thermal conductivity, mechanical strength, reliability, and precision directly determine the performance and lifespan of end products.