Working Principle of Ceramic Water Cooling Plates
Ceramic water cooling plates dissipate heat through advanced thermal and fluid dynamics:
Heat Absorption–High-power components (e.g., IGBTs, laser diodes) transfer heat to the ceramic surface via direct contact or thermal interface materials.
Conduction Through Ceramic–Aluminum nitride (AlN) or silicon carbide (SiC) rapidly conducts heat (170-200 W/mK) to internal microchannel structures.
Microchannel Flow–Coolant (typically deionized water or glycol mixtures) flows through 100-500μm wide channels, achieving turbulent flow (Re >2300) for optimal heat transfer.
Heat Exchange–The ceramic's high specific surface area enables 10-30 kW/m²·K heat transfer coefficients, cooling 50% faster than copper cold plates.
Electrical Isolation–The ceramic body blocks current leakage (>15 kV/mm) while maintaining thermal performance.
Key Features:
Laser-drilled microchannels with ±5μm precision
Active metal brazing (AMB) for leakproof metal-fluid ports
Nano-coated surfaces to prevent biofouling
Used in EV battery cooling and high-power lasers, these plates achieve <0.1°C/mm thermal gradient at 1000W/cm² loads.
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