Wafer Probe Plate is a method of developing and producing semiconductors that allows electrical testing of each wafer. Ceramic probe plate is a vital existence in the field of semiconductor chip manufacturing. It is mostly made of high-quality ceramics or special composite materials, with excellent high hardness and wear resistance, can provide a stable and reliable support platform for the probe, and will not be easily deformed or damaged. Wafer Probe Plate is commonly used to test the quality of wafers or tube cores in the semiconductor industry, and with the increasing demand for electronic devices today, the quality of components of electronic devices has also become an important issue in the semiconductor industry.
Wafer Probing
Wafer probing is a process in semiconductor development and manufacturing after the integrated circuit is applied to the wafer, in which each chip on the wafer is electrically tested to ensure that the wafer does not have defects that may cause low electrical yield after the wafer is assembled into a unit, thereby reducing costs.
Wafer Probing Process
Wafer Probe Plate loads and accurately positions the wafer on a round plate called a wafer chuck, and then uses the needle in the probe card to accurately align with the bonding pads of the wafer. And the Ceramic probe plate, through the coordinated operation of other components, can obtain the detailed information required for precise alignment, so as to accurately configure the probes on the bonding pads that are precisely aligned in both horizontal and vertical directions, ensuring the accuracy and effectiveness of the entire inspection process.