Aluminum Nitride Ceramic Nozzle

Product  Description

Product performance

• Extremely High Thermal Conductivity: This is one of the most prominent advantages of ALN. Its thermal conductivity is as high as 150-220 W/(m·K), comparable to metallic aluminum and far exceeding other ceramics like alumina ceramic tube or aluminum oxide plate. 
• Excellent Thermal Stability and Thermal Shock Resistance: Benefiting from high thermal conductivity and a moderate coefficient of thermal expansion (4.5×10⁻⁶/°C, similar to silicon), components such as AlN nozzles, aluminum nitride crucibles (ALN crucible), and even complex structural parts can withstand drastic temperature changes without cracking easily.
• Outstanding Electrical Insulation: AlN possesses good insulation resistance and dielectric strength, confirming is aluminum nitride a ceramic with excellent insulating properties.
• Excellent Chemical Stability: It exhibits strong resistance to most molten metals, molten salts, and high-temperature corrosive gases. This characteristic not only protects the AlN nozzle but also makes it a preferred material for aluminum nitride tubes and various custom aluminum nitride ceramics components like custom aluminum nitride crucibles or custom aluminum nitride tubes designed for harsh environments.
• High Hardness and Wear Resistance: With a Mohs hardness of approximately 7-8, it possesses excellent resistance to abrasive wear. This characteristic is crucial for components requiring precision finishing and for nozzles in abrasive environments.
• Moderate Mechanical Strength: Processes like optimized sintering can further enhance its strength, enabling manufactured aluminum nitride plates (aluminum nitride sheet or ALN sheet), aluminum nitride plates, and ALN structural components to meet complex mechanical requirements.
• Low Coefficient of Thermal Expansion: Its good match with semiconductor materials like silicon results in low thermal stress, which is a key reason for the widespread use of Aluminum nitride high thermal conductivity substrates and heating plates in semiconductor equipment.

Product application

• Semiconductor Manufacturing Equipment: Serves as gas spray heads or sidewall nozzles in plasma etching and chemical vapor deposition equipment, uniformly distributing corrosive reaction gases.
• High-Temperature Spraying: Functions as nozzles for plasma spraying and flame spraying, withstanding erosion from high-temperature, high-velocity particle streams.
• Laser Cutting and Welding: Serves as auxiliary gas nozzles for laser heads, requiring high-temperature resistance and anti-adhesion properties against metal spatter.
• Chemical and Metallurgical Industries: Used for spraying, atomizing, and metering high-temperature, corrosive gases/liquids.

why choose us

factory strength

 Our company's expert team possesses 20 years of R&D experience, specializing in the independent research, development, and production of advanced ceramic materials and precision ceramics. We have achieved world-class standards and have been recognized as a National High-Tech Enterprise.