Aluminum Nitride Flange

Product  Description

Product performance

• Extremely High Thermal Conductivity: Thermal conductivity can reach 170-200 W/(m·K), comparable to metallic aluminum and 5-8 times that of alumina ceramics, enabling highly efficient heat transfer and dissipation.
• Excellent Electrical Insulation: Possesses outstanding high resistivity, ensuring reliable electrical isolation (aluminum nitride electrical conductivity is low, making it an insulator), making it highly suitable for use as insulating components like AlN Ceramic Substrates (aluminum nitride substrates, aln ceramic substrate, aluminium nitride substrates, aln substrates), AlN Ceramic Wafers (aln wafer, aluminum nitride wafer, aluminium nitride wafer), as well as AlN Optical Module Ceramics and Laser Diode Fixing Ceramic Bushings.
• Thermal Expansion Coefficient Matched to Silicon: Its coefficient of thermal expansion (4.5×10⁻⁶/℃) is very close to that of silicon (3.5×10⁻⁶/℃), significantly reducing thermal stress in applications with drastic temperature changes and preventing connection failures.
• High Mechanical Strength and Hardness: Offers good structural stability and wear resistance, ensuring the reliability of ALN structural component, AlN Parts, and AlN Ceramic Components.
• Outstanding Corrosion Resistance and Chemical Stability: Resists erosion from most molten metals and chemicals, making it particularly suitable for harsh environments. Therefore, it can be used to manufacture AlN Ceramic Crucibles (aln crucible, aluminum nitride crucible), AlN Nozzles, and corrosion-resistant components in semiconductor equipment. 
• Low Dielectric Constant and Low Dielectric Loss: Performs excellently in high-frequency and microwave applications with low signal transmission loss, a key performance feature for AlN Optical Module Ceramics and RF components.
• Precision Machinability and Modifiability: Professional Polishing and Grinding of aln ceramics by aluminum nitride manufacturers/suppliers can achieve surfaces with extremely high precision and smoothness, producing Aluminum nitride polished substrate (ALN polished substrate, AIN polished substrate). 

Product application

• Semiconductor Manufacturing Equipment: Serving as AlN Ceramic Heaters (wafer heaters), AlN Ceramic Chucks (electrostatic chucks), components for CVD/PVD reaction chambers (using AlN Turbines, AlN Nozzles), windows, feedthroughs, or insulating assemblies (such as AlN Sealing Packages/Housings) for plasma etching equipment, especially suitable for RF and microwave power introduction systems. 
• High-Power Electronics and Laser Devices: Used for packaging and AlN Ceramic Substrates, ALN heat sinks for high-power LEDs, laser diodes (Laser Diode Fixing Ceramic Bushings), and RF modules. Aluminum nitride pads are also used for thermal interfacing.
• Vacuum and Scientific Research Apparatus: Used for connection flanges, AlN Ceramic Tubes, and AlN Ceramic Structural Components requiring high thermal conductivity and electrical insulation in synchrotron radiation, particle accelerators, and ultra-high vacuum (UHV) systems.
• Aerospace and Defense Electronics: Used for heat dissipation and packaging of AlN Substrates in high-reliability, high-power-density electronic systems.
• New Energy and Specialized Industries: Such as Energy Storage Battery Ceramic Sealing Rings, AlN Ceramic Crucibles for smelting, and applications of AlN Irregular Parts in special chemical and metallurgical equipment. 
• Optical Communication & Precision Handling: Serving as key heat dissipation and carrier components for AlN Optical Module Ceramics. Microporous ceramic suction cups for delicate part handling may also utilize related ceramic technology.

factory strength

 We research methods to achieve efficient resource utilization, integrating CNC machining technology, industrial IoT technology, and automated control systems to enable interconnected and collaborative operation of production equipment, thereby maximizing production efficiency.