Products Description
Aluminum nitride (AlN) ceramics are a type of technical ceramic material with excellent electrical insulation and high thermal conductivity, and are considered high-performance electronic packaging materials.Aluminum nitride is known for its excellent thermal conductivity, which is even higher in its black variant. This property makes it highly efficient at dissipating heat, making it valuable in applications where heat management is critical, such as in high-power electronics and LED lighting.Aaluminum nitride plate has good electrical insulation properties, which helps prevent electrical short circuits and ensures the safe operation of electronic devices. The thermal expansion and isolation coefficient of Black Aluminum Nitride Plate are highly compatible with silicon wafer products, making it suitable for electronic applications that often face high temperatures and heat dissipation issues. At the same time, Black Aluminum Nitride Plate provides the same high thermal and electrical properties as beryllium oxide at a more economical cost, without toxicity issues, and has therefore been widely used in various fields.
| Product name | Black Aluminum Nitride Plate |
| Material | Aluminum nitride |
| Color | Customized according to the client's requirements |
| size | Customized according to the client's requirements |
| Machining accuracy | ±0.001mm |
| Packaging | Carton /Pallet/Wooden case (According to client requirement ) |
| Delivery time | Standard Product-Within 3 days |
| Items Design | According to the client's drawing or samples |
| Features | Good quality, low price, Multiple factories, deliver to you based on the one closest to your location |
| Application | Industrial Ceramics |
| Certificate | ISO, CE |
advantages
- Good mechanical strength
- Excellent oil, acid, and alkali resistance performance
- Low dielectric constant
- Extremely high thermal conductivity
- Excellent electrical insulation
- Outstanding heat shock resistance
- Low coefficient of thermal expansion
- Good smoothness
- Good metalization ability
- Expansion coefficient can be matched with semiconductor silicon wafers
application
- Insulation components
- Heat dissipation device
- Laser components
- High power electrical insulator
- Power device
- Semiconductor heater
- Etching machine
Ceramics performance parameter
| Number | Performance | Unit | Aluminum Nitride | |
| JC-AN-210 | JC-AN-170 | |||
| 1 | Density | g/cm3 | 3.32~3.34 | 3.31~3.33 |
| 2 | Flexural strength | MPa | 340~360 | 400~420 |
| 3 | Fracture toughness | MPa·m1/2 | 3.35 | 3.35 |
| 4 | Dielectric constant | εr(20℃,1MHz) | 8.8~9.0 | 8.7~8.9 |
| 5 | Hardness | GPa | 12-16 | |
| Hardness | HRC | 75-80 | ||
| 6 | Volume resistivity | Ω·cm(20℃) | 10 10 | 10 10 |
| 7 | Elastic modulus | GPa | 310 | 320 |
| 8 | Coefficient of thermal expansion | ×10-6/k | 4.8~5.0 | 4.5~4.7 |
| 9 | Compressive strength | MPa | 2100 | 2000 |
| 10 | Abrasions | g/cm2 | 0.01 | 0.01 |
| 11 | Thermal conductivity | W/m×k(20℃) | 200~220 | 160~180 |
| 12 | Poisson's ratio | / | 0.24 | 0.24 |
| 13 | Insulation strength | kv/mm | 26~28 | 30~32 |
| 14 | Temperature | ℃ | 2500 | 2500 |
About Us
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