99.7%/99.8%/99.9% Alumina Ceramic Lapping Plate

99.7%/99.8%/99.9% Alumina Ceramic Lapping Plate

High-purity alumina Ceramic lapping plates are precision ceramic components sintered at high temperatures from α-alumina (α-Al₂O₃) with a purity of 99.7% or higher...
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Description

Products Description

 

High-purity alumina ceramic grinding discs refer to precision grinding tools sintered through advanced ceramic processes using alumina (Al₂O₃) with a purity ranging from 99.7% to 99.9%. Their exceptionally high purity ensures minimal impurity content, endowing them with a range of superior properties that surpass ordinary industrial alumina ceramics (such as 95 alumina ceramic or 96% alumina ceramics) and metallic materials. This makes them critical consumables in high-end precision machining applications. While belonging to the same family of alumina structural ceramics as common components like alumina ceramic plates (alumina sheets/al2o3 sheet), alumina tubes (al2o3 tube), and alumina rings, these precision alumina ceramic parts demand stricter requirements for purity, flatness, and microstructure, placing them at the premium end of alumina ceramic products.

 

99.7%/99.8%/99.9% Alumina Ceramic Lapping Plate

 

product performance

 

  • Exceptional Wear Resistance: Extremely high hardness with minimal wear rate, significantly outlasting conventional grinding discs.
  • Superior Flatness & Dimensional Stability: Consistent sintering enables machining to exceptional planarity, outperforming standard alumina plates or aluminum oxide sheets. Low thermal expansion ensures stability, making it suitable for ultra-precision machining.
  • High Rigidity, No Plastic Deformation: Unlike metal discs, it does not undergo plastic deformation under sustained pressure, consistently maintaining its initial flatness. This property is also valuable for alumina ceramic substrates and alumina carrier plates.
  • Chemical Inertness: Does not contaminate grinding slurries, maintaining stable slurry performance and facilitating easy cleaning.
  • Smooth Operation, Low Vibration: High rigidity and uniform microstructure (distinct from porous alumina ceramic) ensure stable operation at high speeds.

 

ceramicstimes performance parameter

 

Product application

 

  • Semiconductors & Integrated Circuits: Back-thinning, edge grinding, and planarization pretreatment for silicon wafers, compound semiconductors, and sapphire substrates. Their material properties align with the fine alumina powders used in manufacturing alumina ceramic wafers and alumina substrates.
  • Precision Optics: Fine grinding of optical glass, crystals, and ceramic alumina substrates.
  • Brittle Material Processing: Surface grinding of advanced ceramics such as alumina ceramic structural parts, valve parts, and alumina-toughened zirconia.
  • Laboratory Sample Preparation: Precision grinding for metallographic and electron microscope specimens.
  • Other Precision Surfaces: Processing of hard disk platters and magnetic substrates.

 

Reasons for Selection

 

 Our company actively responds to the directives set forth by the General Secretary: serving national strategies, supporting pillar industries, advancing scientific and technological innovation, and fostering self-reliance and self-strengthening.

 Our expert team, with 20 years of R&D experience, specializes in the independent research, development, and production of advanced ceramic materials and precision ceramics, achieving world-class standards and levels of excellence.

 

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