Dielectric ceramic materials are critical foundational materials in the field of electronic information. Owing to their unique physical properties-including dielectric, piezoelectric, ferroelectric, pyroelectric, electrocaloric, and electro-optic effects-they play an irreplaceable role in modern electronic components such as capacitors, filters, piezoelectric actuators, and energy storage devices. From the miniaturization and capacitance enhancement of multilayer ceramic capacitors, to the high-frequency operation capability and low dielectric loss characteristics of microwave dielectric ceramics in 5G/6G communication systems, and to the continuous improvement in energy density of energy-storage ceramic materials for high-power pulsed power technology, dielectric ceramics have consistently driven the evolution of electronic components toward higher frequencies, higher integration, miniaturization, and enhanced reliability.
Furthermore, with the continuous rise in communication frequency bands, dielectric ceramics are expanding from traditional radio frequencies toward microwave, millimeter-wave, and even terahertz bands. However, high-frequency applications intensify challenges such as dielectric loss, localized heat accumulation, interfacial scattering, and defect-induced polarization. These demand higher standards for low loss, thermal stability, power-handling capability, and long-term service reliability of materials.
The rapid development of the semiconductor and electronic information industries imposes ever-increasing performance requirements on core materials. As key foundational materials that couple multiple functionalities-electrical, magnetic, thermal, and mechanical-electronic ceramics are widely used in capacitors, filters, sensors, packaging substrates, and other critical components. Among these, ceramic substrates represent an important product form of electronic ceramics in power semiconductor packaging. Their thermal conductivity, mechanical strength, reliability, and precision directly determine the performance and lifespan of end products. This work addresses core issues related to the design, preparation processes, performance characterization, and application scenarios of ceramic substrates and electronic ceramic materials.